| Models | Eclipse B3 | Eclipse B2 | Eclipse B2 plus | Eclipse B1 |
| Sheet format | Up to 353 x 500mm (Eclipse B3) / up to 500 x 707mm (Eclipse B2 / B2 Plus) / up to 707 x 1000mm (Eclipse B1) |
| Media thickness | 0.11 mm - 0.6 mm (Eclipse B3, Eclipse B2) / N-F+g up to 1.2 mm (Eclipse B2 Plus, Eclipse B1) |
| Speed | Eclipse B3: up to 1000 sheets/hour | Eclipse B2: up to 1500 sheets/hour | Eclipse B2 plus: up to 3000 sheets/hour | Eclipse B1: up to 2000 sheets/hour |
| Processing types | Laser cutting for commercial applications / Mechanical creasing + laser cutting (leaflets, greeting cards) / Cross mechanical creasing + laser cutting (calendars, boxes, cartons) |
| Feeder | Eclipse B3, Eclipse B2, Eclipse B2 Plus: Pile sheet feeder with register, pallet sheet feeder with barcode recognition system / Eclipse B1: Pallet sheet feeder with barcode recognition system |
| Creasing | 1 up to 4 crease position cameras. Self-programmable parallel creases. Self-programmable cross creases (continuous). Automatic rotation + cross creasing in 2 steps |
| Laser cutting | 2 self-registration laser cameras. Suction sheet transport with calibrated steel cables. Laser type: COâ‚‚ with Galvanic mirror. Registration by print marks or sheet edges. Simplified maintenance, with constant power output and NEP Technology (sealed source laser). |
| Laser power (Watt) | 350 – 550 – 750 – 1100 |
| Blanking & stripping | Frame removal, blanking/stripping |
| Media output | Shingle/batch stacking. Pile stacking. Separate individual shape delivery (optional on Eclipse B2 Plus) |
| Software | Supported file types: PDF, EPS, PLT, DWG, DXF. Integrated CAD software. Auto notch positioning and modification. Automatic cut path optimization (compensating for material shrinkage). Pen association (speed & power). Job list management. Remote control capability (networked). Production monitoring and downtime reduction with external management software (optional) |